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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
DUAL COLOR LED LAMPS
Pb
Lead-Free Parts
LEG3392/R1-PF
DATA SHEET
DOC. NO : REV. DATE : :
QW0905- LEG3392/R1-PF A 25 - Apr. - 2005
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LEG3392/R1-PF Page 1/6
Package Dimensions
5.0
5.9
7.6
8.6
10.5O 0.5
1.5MAX
G
E
1/4
0.5 TYP
18.0MIN
1
2
3
2.0MIN
1
2
3
2.0MIN
-+1.CATHODE GREEN 2.COMMON ANODE 3.CATHODE ORANGE
2.54TYP
2.54TYP
Note : 1.All dimension are in millimeter tolerance is O 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
Directivity Radiation
0X -30X 30X
-60X
60X
100% 75% 50%
25%
0
25% 50% 75% 100%
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LEG3392/R1-PF Page 2/6
Absolute Maximum Ratings at Ta=25 J
Ratings Parameter Symbol E Forward Current Peak Forward Current Duty 1/10@10KHz Power Dissipation Reverse Current @5V Operating Temperature Storage Temperature Soldering Temperature IF IFP PD Ir Topr Tstg Tsol 30 120 100 10 -40 ~ +85 -40 ~ +100 Max 260J for 5 sec Max (2mm from body) G 30 120 100 mA mA mW UNIT
g A J J
Typical Electrical & Optical Characteristics (Ta=25 J)
PART NO
MATERIAL Emitted GaAsP/GaP Orange
COLOR
Peak wave length f Pnm
Spectral halfwidth Gf nm
Forward voltage @20mA(V)
Luminous intensity
@ 10mA(mcd)
Viewing angle 2c 1/2 (deg)
Lens 635 White Diffused 565 45 30
Min. 1.7 1.7
Max. 2.6 2.6
Min. 0.5 1.2
Typ. 1.2 1.8 76 76
LEG3392/R1-PF
GaP
Green
Note : 1.The forward voltage data did not including O 0.1V testing tolerance. 2. The luminous intensity data did not including O 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LEG3392/R1-PF Page 3/6
Typical Electro-Optical Characteristics Curve
E CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
3.0
1000
Forward Current(mA)
100
Relative Intensity Normalize @20mA
2.0 3.0 4.0 5.0
2.5 2.0 1.5 1.0 0.5 0.0
10 1.0
0.1 1.0
1.0
10
100
1000
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
1.1 1.0 0.9 0.8 -40 -20 0 20 40 60 80 100
Relative Intensity@20mA Normalize @25J
Forward Voltage@20mA Normalize @25J
1.2
Ambient Temperature(J)
Ambient Temperature(J)
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
1.0
0.5
0.0 550 600 650 700 750
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LEG3392/R1-PF Page 4/6
Typical Electro-Optical Characteristics Curve
G CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
3.5
1000
Forward Current(mA)
100
Relative Intensity Normalize @20mA
2.0 3.0 4.0 5.0
3.0 2.5 2.0 1.5 1.0 0.5 0.0
10 1.0
0.1 1.0
1.0
10
100
1000
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
3.0 2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
1.1 1.0
0.9 0.8 -40 -20 0 20 40 60 80 100
Relative Intensity@20mA Normalize @25J
Forward Voltage@20mA Normalize @25J
1.2
Ambient Temperature(J)
Ambient Temperature(J)
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
1.0
0.5
0.0 500 550 600 650
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LEG3392/R1-PF Recommended Soldering Conditions 1. Wave Solder Soldering Soldering Iron:30W Max Temperature 300XC Max Soldering Time:3 Seconds Max Distance:2mm Min(From solder joint to case) Page 5/6
Temp(XC) 245XC 5sec Max
245 X Preheat
120X
2X/sec max
2X/sec max
2X/sec max Time(sec)
120 Seconds Max
Dip Soldering Preheat: 120XC Max Preheat time: 120 seconds Max Ramp-up:2XC/sec(max) Ramp-Down:2XC/sec(max) Solder Bath:245XC Max Dipping Time:5 seconds Max Distance:2mm Min(From solder joint to case)
2. PB-Free Wave Solder
Temp(XC) 265XC 5sec Max
265X
Soldering Soldering Iron:30W Max Temperature:350 XCMax Soldering Time:3seconds Max Distance:2mm Min(From solder joint to case)
120X
Preheat
2X/sec max
2X/sec max
2X/sec max Time(sec) 120 Seconds Max
Dip Soldering Preheat: 120XC Max Preheat time: 120seconds Max Ramp-up:2XC/sec(max) Ramp-Down:2XC/sec(max) Solder Bath:265XC Max Dipping Time:5 seconds Max Distance:2mm Min(From solder joint to case)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LEG3392/R1-PF Page 6/6
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=20mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resisance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under ondition of high temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 JO 5J 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65JO 5J 2.RH=90 %~95 % 3.t=240hrs O 2hrs
The purpose of this test is the resistance of the device under tropical for hous.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 J O 5J&-40JO 5J (10min) (10min) 2.total 10 cycles
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 JO 5J 2.Dwell time= 10 O 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 JO 5J 2.Dwell time=5 O 1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2

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